INTERNATIONAL CONFERENCE ON

International Conference on Semiconductors & AI Computing

CONFERENCE THEME
Neuromorphic Chiplet Architectures and Extreme Ultraviolet Scaling Nodes
Date
April 18-20, 2024
Venue
Tokyo Big Sight International Exhibition Center, Tokyo, Japan
International Conference on Semiconductors & AI Computing
Successfully
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Semiconductors

ABOUT CONFERENCE

Tokyo hosted the landmark Semiconductors 2024 edition, introducing groundbreaking advancements in silicon processing and neuromorphic computing. The sessions examined micro-architecture limitations, chiplet designs, and hardware-software co-design paradigms.

Leading tech firms showcased their physical prototype chips in the central exhibition area. Academic representatives engaged in networking sessions focused on transferring university-level research directly into industry solutions.

The event successfully closed with panels outlining a collaborative roadmap for sustainable computing infrastructures. Participants praised Tokyo as an inspiring setting that matched the tech focus perfectly.

Event photograph
Event photograph
Event photograph
CONFERENCE INFORMATION
DATES
April 18-20, 2024
VENUE
Tokyo Big Sight International Exhibition Center, Tokyo, Japan
Download Information

Scientific Sessions

Neuromorphic Hardware Structures

Designing hardware nodes imitating brain neuron structures to build ultra-efficient AI systems.

Chiplet Scaling & Interconnects

Addressing bandwidth boundaries between stacked chip dies via advanced photolithography packaging.

Silicon Fab Automation & AI Control

Applying machine learning loops inside clean room silicon fabrication pipelines.

Sub-nanometer Photolithography

Next-gen Extreme Ultraviolet (EUV) photolithography steps to scale logic nodes.

Quantum Computing Hardware Nodes

Focusing on superconducting qubits, cryogenic interfaces, and hardware error correction systems.

Advanced Materials & Wide Bandgap Tech

Deploying Gallium Nitride (GaN) and Silicon Carbide (SiC) logic layers for high-efficiency power.

Thermal Management in High-Density Packages

Heat dissipation designs, microfluidic cooling, and multi-die thermal isolation.

Power Electronics & Energy-Efficient Design

Low-voltage scaling limits, dynamic voltage controls, and high-frequency logic power.

Organizers & Speakers

Prof. Deepak Sehgal

Prof. Deepak Sehgal

Committee Member
Shiv Nadar University, India
Prof. Hilda N. Shilubane

Prof. Hilda N. Shilubane

Committee Member
University of Venda, South Africa
Dr. Masaru Shimada

Dr. Masaru Shimada

Keynote Speaker
Yokohama City University, Japan
Dr. Xiao Zhang

Dr. Xiao Zhang

Featured Speaker
Fudan University, China
Dr. Filippo Pacciarini

Dr. Filippo Pacciarini

Featured Speaker
Sapporo Teishinkai Hospital, Japan

Conference Gallery

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🏒 VENUE DETAILS & AMENITIES

City attraction
City attraction
City attraction
Check-in: From 3:00 PM
Check-out: Before 12:00 PM
Free High-Speed Wi-Fi
Fully Equipped Conference Hall
Projector, Screen & Audio System
Air-Conditioned Meeting Rooms
Coffee Breaks & Lunch Included During Conference
Vegetarian & Non-Vegetarian Food Options Available
Swimming Pool Access
Fitness Center / Gym
Breakfast Included with Rooms
24-Hour Front Desk

CONFERENCE HOTEL

Tokyo Big Sight International Exhibition Center

ADDRESS

3-11-1 Ariake, Koto City, Tokyo 135-0063, Japan

Japan's premier exhibition and conference center. Known for its iconic architecture, massive plenary theaters, advanced translator devices, and complete high-tech amenities.

What Delegate Say

Background

"The neuromorphic logic panels offered incredible insights. Bridged university R&D directly with fabrication leaders."

Dr. Masaru Shimada
Delegate
Background

"Tokyo offered an inspiring backdrop. Perfect alignment of advanced tech focus and venue facilities."

Dr. Xiao Zhang
Delegate

Company Attendees

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Media Partners

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Get In Touch

β€œWe’re Here To Redefine The Conference, Making It Not Just Informative But Truly Inspiring And Memorable Conference.”

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International Conference on Semiconductors & AI Computing | Wisdom Conferences